Aries has introduced a 1441-ball version of its unique PinBall IC socket, featuring a customised heatsink, designed for high-end graphics processors. It can be soldered directly to the existing footprint of a PC board, further increasing packaging density.
An aluminium heatsink provides effective thermal dissipation of excess heat generated by high performance graphics processors. The versatile BGA/LGA socket provides 2 mm of clearance for end components and can be used for 0,80, 1,00 mm and 1,27 mm pitch packages up to 50 mm, in any footprint configuration and on any size board.
The socket incorporates Aries' high reliability spring probe technology, with a spring force of 17 g. The spring is BeCu alloy, and the pins are gold-plated brass alloy.
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