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Ampro to deliver rugged COM Express solution
20 April 2005, Computer/Embedded Technology
Ampro Computers, a manufacturer of rugged ETX modules, has announced its commitment to deliver its first module compliant with PICMG's COM Express Specification before the end of 2005. Ampro expects its COM Express solutions to offer the same rugged features found on its ETX modules, including a thicker PCB for better connection between the module and baseboard, fanless operation to 70°C, and optional extended temperature operation from -40 to 85°C.
While several module manufacturers have announced similar COM Express commitments for their respective market segments, Ampro's presence ensures that manufacturers of medical, military, industrial, and transportation OEMs will have a supplier of COM Express modules to meet both stringent and low cost design requirements.
"Ampro intends to bring its proven expertise with low-cost and rugged modular computers to a market that demands practical, deployable, and reliable technology," said Joanne Mumola Williams, president and CEO of Ampro. "Ampro's long-term experience meeting the rigours of military, transportation, industrial, and medical requirements will give these OEMs a better alternative to lab and desktop quality modules that require fans and other exotic cooling solutions which are generally not suitable for embedded applications."
Ampro's design will be based on the Intel Pentium M family of processors, with state-of-the-art chipset technology supporting PCI Express. I/O signals and bus expansion are provided to a carrier board or baseboard, where I/O can be customised to the application requirements. |
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