Stainless steel valves for precise thin-film fluid deposits
4 May 2005Manufacturing / Production Technology, Hardware & Services
OK International has added two new stainless steel valves to its Techcon Systems' TS5500 Series Spray Valve family. The TS5540 and the TS5540F spray a fine mist of low-viscosity materials such as conformal coating, solvent, oil and grease, precisely and consistently for thin-film fluid deposits.
These valves come with a variety of nozzle/cap configurations for spraying different fluid deposit patterns and sizes. The TS5540's three cone-shaped nozzles/caps are for spraying three sizes of circular-shaped deposits. The TS5540F's three fan-shaped nozzles/caps are for spraying three sizes of elliptical-shaped deposits.
Both valves have a 4,8 bar activation pressure and handle fluid pressure at a maximum of 6,9 bar. Other than the different nozzles/caps, TS5540 and TS5540F are identical in construction of the main valve body. A smooth fluid path reduces turbulent flow and air entrapment ensuring consistent, precise and repeatable spraying. In addition, they feature an external stroke control that adjusts for different fluid flow and provides a fast, positive shut-off.
With rugged construction, a field-replaceable Delrin seat and a field-replaceable seal, the TS5540 and TS5540F offer a long life cycle and are service friendly. They are compatible with a wide range of aggressive and non-aggressive industrial chemicals.
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version