Interconnection


First Gigabit Power over Ethernet module announced

18 May 2005 Interconnection

Molex has developed its HyperJack 1000 Gigabit Power over Ethernet (PoE) module. The multiport module integrates magnetics that support Ethernet 10/100/1000 and high-performance power management silicon from Texas Instruments (TI).

"Customers continue to demand flexible port configurations and a migration path from non-PoE to fully integrated PoE designs," said Vincent Eissenmenger, PoE program manager with Molex. "Molex's IEEE 802.3af-compliant PoE module provides the networking industry with the most cost-effective and easiest method of managing power over existing Ethernet cabling infrastructure."

To maximise customer design flexibility, the HyperJack 1000 module's fully shielded connector is available in multiple port configurations, including 2-by-4 and 2-by-6. In addition, the PoE module contains up to three TI TPS2384 power management integrated circuits. The versatile, quad-port TPS2384 power manager can support operations over the temperature range -40 to +125°C for a wide range of commercial, industrial, and military uses. Potential applications range from sophisticated enterprise systems with up to 128 ports to low-port count hub Ethernet switches for SOHO applications.

"TI collaborated closely with Molex to produce a family of high quality PoE RJ-45 modules capable of supporting a broad range of power source equipment," said Rich Valley, vice president of TI's system power management business. "We see these new modules as an extremely easy way for designers to quickly implement a PoE-compliant system."

The HyperJack 1000 PoE module is currently undergoing qualification at selected customers. It is scheduled to be released to the market in the fourth quarter 2005.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Microchip expands its Arm Cortex-M0+ portfolio
Altron Arrow DSP, Micros & Memory
PIC32CM PL10 MCUs feature a rich set of Core Independent Peripherals, 5 V operation, touch capabilities, integrated toolsets, and safety compliance.

Read more...
More room to scale
Altron Arrow Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.

Read more...
4 mm pitch power connectors
Spectrum Concepts Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.

Read more...
56 G MezzaWave connectors and cable assemblies
Interconnection
Engineered to deliver notable signal integrity, TE Connectivity’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular system

Read more...
Space SMPM and SMPM-Lock connectors
Hiconnex Interconnection
Radiall has released the Space SMPM and SMPM-Lock, miniature Space connectors for high-frequency performance and high-density applications.

Read more...
Space saving SMD common-mode chokes
Electrocomp Passive Components
TDK Corporation presents the EP21 series of flat-wire double chokes designed for common-mode EMI filtering and available in an SMD format with dimensions of only 23,8 x 17,7 mm and heights ranging from 21,6 to 22,3 mm

Read more...
Compact, high density, heavy duty, thermoplastic connectors
TRX Electronics Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.

Read more...
Samtec supports SGeT oHFM.c with high-performance interconnects
Spectrum Concepts Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.

Read more...
Multi-constellation GNSS module in a legacy-compatible footprint
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.

Read more...
Compact SSI family for industrial automation
Altron Arrow Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved