Interconnection


High density differential arrays deliver up to 1 Tbps

18 May 2005 Interconnection

The new Samtec Differential Pair Arrays (DPAM/DPAF Series) provide performance of up to a terabit per connector with up to 168 usable signal pairs. The signal pairs are on a staggered layout with perimeter grounds to reduce the overall number of grounds needed as well as simplify signal routing on the boards.

This connector set has a 10 mm mated height and features solder crimped to the tails for easier processing. The insertion and withdrawal forces of this array system are lower than most high density connectors. Final Inch data is available for 168 signal pairs. Other standard sizes are 48 and 104 signal pairs.

Samtec simplifies specifying and use of high speed connectors by extending the concept of recommended PCB pad layouts and SPICE models beyond the connector and board interface. Samtec Final Inch reference designs address one of the most difficult design issues on the board: the trace breakout region around high speed connectors. These proprietory designs save customer design, development, and validation time and resources and are available free of charge to customers who specify and use Samtec connectors.





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