Handheld control cases for rough environments
15 June 2005
Manufacturing / Production Technology, Hardware & Services
For some time, design engineers have been demanding more robust handheld enclosures with greater internal space for components such as large graphics displays, sealed cable glands, membrane keypads, mechanical keyboard assemblies, data storage devices and emergency stop switches.
OKW answered these market demands with the Hand-Terminal cases. These tough enclosures are manufactured in a new type of impact-resistant material, which is a blend of ABS and polycarbonate and is rated UL 94 V-0. Two standard colours are offered: off-white and black.
Hand-Terminal cases offer electronics engineers many unique design features: firstly, the top panel is wider than the base section, which provides a large display and keypad area for greater functionality, without making the unit too big to hold. The top panel can also be ordered with a closed operating area or a removable aluminium control panel. Secondly, the base section has a deep area at the top end for larger components such as emergency stop switches. Thirdly, the hand grip area is narrow, formed for comfortable holding, and it also contains the battery compartment. As a result, the weight of the batteries is balanced in the hand, so as not to put a fatiguing load over the user's wrist.
The external dimensions of the Hand-Terminal cases are 220 x 120 x 65 mm. The cases can also be sealed to a high degree from ingress of water and dust with an IP 65 sealing kit accessory. Optional screw-in battery compartment cradles are available for one or two 9 V cells or four 1,5 V AA cells. The top and base mouldings include a large array of screw fixing pillars for mounting the components inside.
Typical applications will include machine controllers, outdoor data-collection units, mobile terminals, flowmeters, programmers and more.
Further reading:
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.
Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.
Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...