Lead free manual soldering easier with underheating
13 July 2005Manufacturing / Production Technology, Hardware & Services
Lead (Pb)-free soldering requires temperatures elevated by around 30°C. To avoid problems connected with excessive temperatures from above, rework specialist, Martin, has introduced a new underheater. As a long-established expert of infrared (IR) underheaters, Bernhard Martin developed the Hot-Beam-03, an instant quartz heater, which heats the printed circuit board quickly and within allowable limits to approximately 130°C.
Commonly, a lead-free melting point of 217°C applies. This requires a solder joint temperature of 230°C. The highest temperatures permitted for components, however, range between 240 and 260°C. A simple increase of the soldering iron temperature by 30 to 50°C for Lead-Free would therefore be risky. To avoid such problems, the Hot-Beam-03 takes over half of the thermal effort from underneath the PCB. The combination of a lower soldering iron temperature and underheating, ensures gentler treatment of the PCBs and components.
However, the heating process still remains challenging, says Martin. Therefore its program-controlled IR underheater uses a self-learning process, and a precisely defined and constant thermal mass is maintained by a particularly fine sensor control. It is now possible to use a soldering iron with a process-friendly temperature to work precisely, without rejects and significantly safer and with fewer risks.
The new compact unit offers an active surface of 10 x 13 mm and a power output of 500 W. A practical PCB holder, Smart-Fix-04, is also available.
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