Telecoms, Datacoms, Wireless, IoT


High-density T1/J1/E1 line interface units

27 July 2005 Telecoms, Datacoms, Wireless, IoT

IDT's new family of high-density line interface units (LIU) for the T1/E1/J1 market provides an optimised set of solutions for tributary aggregation in applications such as multiservice provisioning platforms (MSPP), optical multiplexers, edge routers and wireless transport systems. The family includes 28- (82P2828), 21- (82P2821) and 16-channel (82P2816) options in ultra-small packages. According to IDT, the new devices offer nearly four times the density of other LIU solutions on a single chip, saving at least 20% in board space. This high-density LIU family also offers very flexible line and system interface configuration options to address a wide range of applications. The industry standard system interface ensures support for both commercial and custom framing and mapping circuits with standard TDM interfaces. Each channel can be selected to operate independently in T1, J1 or E1 (75/120 Ω) modes.





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