Interconnection


Unique centre probe socket for universal device package debugging

21 September 2005 Interconnection

Aries Electronics offers a unique, solderable centre-probe socket that enables users to debug a wide range of package types - BGA, UBGA, MLF, QFN and others - on the same package footprint. This surface mount adapter securely connects to standard Aries centre-probe test sockets, providing a quick and highly reliable package test on populated PCBs.

The new debugging socket provides 1,52 mm clearance for 0,80 mm and higher package pitch. The socket pressure-mounts to the adapter, which is soldered to the pre-existing PCB footprint via standard reflow process.

This Aries debug socket features an insertion loss of only 1 dB up to 5 GHz. Socket cycle life is over 100 000 insertions and withdrawals. Useable for virtually all packages up to 13 mm square, the socket is particularly suited for SRAM and DRAM packages.



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