Telecoms, Datacoms, Wireless, IoT


BlueMoon shines - Infineon first to receive Bluetooth Qualification for a complete system solution

22 November 2000 Telecoms, Datacoms, Wireless, IoT

Infineon Technologies announced that its BlueMoon I chipset has received Bluetooth qualification and will be included on the Bluetooth Qualified Product List (BQPL). Infineon says it is the first semiconductor company to receive Bluetooth qualification for a complete system solution including the baseband IC, the radio frequency transceiver as well as the link manager (LM) and host controller interface (HCI) firmware. The qualified BlueMoon solution supports both voice and data.

7 Layers AG, a test solution provider and accredited Bluetooth Qualification Test Facility (BQTF) in Ratingen Germany, performed the conformance testing and qualification. 7 Layers offers full scope Bluetooth conformance and interoperability testing as well as qualification services. The company has three manufacturer-independent Bluetooth Qualification Bodies (BQBs) which are authourised to list the related products on the BQPL. This mandatory qualification is the most important step to the development of Bluetooth compatible end-products, labelled with the Bluetooth logo. This qualification provides Infineon's customers early access to officially proven and tested Bluetooth silicon.

The BlueMoon I chipset consists of two ICs, a versatile baseband IC and a highly integrated RF transceiver. The baseband IC integrates a program ROM containing the complete link manager and host controller Interface as well as an external flash memory interface for rapid prototyping and product adaptation. It supports both data and voice over the UART or voice over the PCM interface. The transceiver integrates the full transmit and receive chains including the VCO, LNA and requires no external SAW or ceramic filters. The excellent performance of the BlueMoon solution gives, at its output power of +4 dBm, a range of up to 100 m.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Wi-Fi 6 and Bluetooth LE co-processor
Altron Arrow Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.

Read more...
Improving accuracy of outdoor devices
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.

Read more...
New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
Next-level Software Defined Radio
IOT Electronics Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.

Read more...
High-performance Zigbee and BLE module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.

Read more...
Championing local PCB manufacturing
Master Circuits Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.

Read more...
How IoT-driven smart data helps businesses stay ahead
Trinity IoT Telecoms, Datacoms, Wireless, IoT
With around 19 billion IoT devices globally, embedded in everything from machinery to vehicles to consumer products, reliable data is plentiful.

Read more...
Robust series of vertical-mating battery connectors
Electrocomp Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.

Read more...
IoT-optimised LTE Cat 1 bis module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.

Read more...
Chip provides concurrent dual connectivity
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved