Power Electronics / Power Management


New family of IGBT semiconductor modules set a new standard in performance

22 November 2000 Power Electronics / Power Management

Semikron offers a new generation of three-phase IGBT modules with the SKiM family (Semikron Integrated Module) which is also based on SKiiP technology. The module family, seen at the PCIM 2000, was designed for drive applications and various applications such as uninterrupted power supplies (UPS), welding, electric vehicles, wind power plants, etc. Presently, the new module family comprises the versions SKiM 3, SKiM 4 and SKiM 5. The three module types cover a wide range of power levels, leading to a considerable reduction in logistic cost.

SKiiP technology ensures the following advantages: the modules do not require a baseplate; thermal pressure contacts (no soldering, therefore increased reliability); spring terminals for adapting the driver board to the control terminals (SKiM 4 and SKiM 5); integrated temperature sensor (SKiM 4 and SKiM 5); ultra-low, compact housing with low-inductance and a homogeneous current distribution SKiM modules are available in three different sizes (SKiM 3, SKiM 4 and SKiM 5), either as six-pack or dual-pack configuration, and cover the power range from 75 to 1200 A for 1200 V components. Due to its internal structure a dual-pack configuration is possible with the six-pack module, without derating of the output current. The module connection height is 17,5 mm.

Two variants of the SKiM 3 are available in 1200 V NPT-IGBT and CAL diodes (85 and 125 A at THS =25°C). With SKiM 4 and SKiM 5 1200 V, the IGBTs of the next generation allow these modules a higher power load with which values of 250 A (SKiM 4) and 350 A (SKiM 5) at THS = 25°C can be reached.

In addition to the 1200 V versions, the SKiM module family will also be available in 600 and 1700 V versions.

With the SKiM module family Semikron sets a new standard for IGBT power modules with regards to compactness and reliability at a high-power output. The combination of the reliability of SKiiP technology and comprehensive standardisation has the potential for defining a new industrial standard. For power levels ranging from 85 A to 1200 A (1200 V) per switch, these power modules offer significant advantages with respect to logistics and system integration specifically when input bridge driver and current sensors are available.



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