Helicomm has demonstrated a series of ZigBee-Ready module products at the ZigBee Alliance Member Meeting and Open House in September. The demonstration showcased the ZigBee-ready networking modules co-developed with Silicon Laboratories, a leader in high performance analog-intensive, mixed-signal ICs.
"We strive to provide the most complete ZigBee-Ready wireless solution for customers," said Helicomm president, Jack Sun. "This alliance enables Helicomm to combine our flexible networking software and FCC-certified modules with Silicon Labs' high-performance CMOS microcontroller, flexible tool set expertise and global presence into broadest range of standards-based wireless networking solutions."
"Our partnership enables the delivery of a turnkey hardware and software solution for the short range wireless market," said Derrell Coker, vice president of Silicon Laboratories. "We offer customers a high performance, ultra low power, highly integrated solution for their wireless applications like monitoring and control."
The line of ZigBee-ready products consists of four IP-Link embedded modules, as indicated in the table. Featuring Silicon Laboratories' 8051-based microcontrollers, the new IP-Link Modules provide a broad selection of high performance and low power networking solutions. Offering small form factor and flexible antenna options, these modules support customers to either embed applications or use them as plug-and-play modems.
MCU for low-power, IoT applications NuVision Electronics
DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.
Read more...Industrial Ethernet time sensitive networking switch RS South Africa
Telecoms, Datacoms, Wireless, IoT
The ADIN3310 and ADIN6310 are 3-port and 6-port Gigabit Ethernet time sensitive networking (TSN) switches with integrated security primarily designed for industrial Ethernet applications.
Read more...Automotive-grade digital isolators
Telecoms, Datacoms, Wireless, IoT
The NSI83xx series of capacitive-based isolators from NOVOSENSE Microelectronics offer superior EOS resilience and minimal power noise susceptibility.
Read more...ICs vs modules: Understanding the technical trade-offs for IoT applications NuVision Electronics
Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.
Read more...Marktech’s latest LEDs and photodiodes NuVision Electronics
Test & Measurement
Designed for precision sensing and emission tasks, Marktech’s optoelectronic lineup serves medical, industrial, aerospace, and environmental markets.
Read more...Why bis means business for LTE Cat 1 IoT connections NuVision Electronics
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.
Read more...Wi-Fi in 2025: When is Wi-Fi 7 the answer? iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Wi-Fi 7 introduces multi-link operation and lower latency, a game-changing feature that allows devices to transmit and receive data across multiple frequency bands simultaneously to significantly reduce network congestion.
Read more...Bluetooth Lite SoCs purpose built for IoT NuVision Electronics
Telecoms, Datacoms, Wireless, IoT
Whether it is enabling predictive maintenance on industrial equipment, tracking assets in dense environments, or running for years on a coin cell battery in ultra-low power sensors, developers need solutions that are lean, reliable, and ready to scale with emerging use cases.
Read more...LTE Cat 1bis module Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
The A7673X LTE Cat 1bis module from SimCom is engineered to meet the growing demands of the IoT industry, offering exceptional performance and seamless integration.
printer friendly version