Tyco Electronics has introduced a new low profile, single connector, micro-miniature RF interconnect to meet the growing demand for direct board-to-board connections.
Traditionally, board-to-board RF connections have been achieved by using either two cable connectors or perhaps two board connectors with a third, spacer or bullet, between. Both of these options can add significant cost and assembly time. Tyco's new Compression Coax Board-to-Board Blindmate product eliminates the need for these multiple connectors - and their added cost - by offering a single connector assembly with spring-loaded contact.
One side of the connector is soldered on the base circuit board surface and the other side mates directly on the opposite target board using applied spring pressure. This 'one piece' design offers an easy connection with large radial and axial misalignment, and eliminates the risk of breaking soldered connections when mating or un-mating.
This product is initially available in three different lengths for board spacing of 6,65 mm, 10 mm and 14 mm, and is supplied in trays for pick-and-place. The connector has an operating temperature range of -40 to +125°C, impedance of 50 Ω, and can operate effectively at frequencies up to 6 GHz.
Return loss is specified as a minimum -20 dB at up to 2,2 GHz. Tolerance against axial misalignments from the nominal board stacking height is specified as ±1,0 mm (for the 10 and 14 mm versions), and ±0,4 mm (for 6,65 mm version). Tolerance against radial misalignment is ±0,8 mm from centreline, in any direction, for all three versions.
The target pads, typically contacting a gold-plated PCB target, can be tin-plated, or a gold-plated disc can be applied to the mating PCB for improved characteristics. Additional sizes can be developed to customer request.
For more information contact Quentin van den Bergh, Arrow Altech Distribution, +27 (0)11 923 9600, [email protected]
Low profile SMD antenna Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The Havok PCS.06.A antenna, from Taoglas, is a low profile SMD LTE/cellular 4G/3G/2G embedded antenna designed for direct SMD mount on a device PCB.
Read more...Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Connectivity solutions for hydrogen technologies Hiconnex
Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.
Read more...Mixed-density Combo-D connectors Hiconnex
Interconnection
Positronic’s SCBM connector series is a rugged, high-performance family of mixed-density D-sub connectors engineered for demanding environments.
Read more...Same Sky expands rectangular connector portfolio Future Electronics
Interconnection
The portfolio includes male pin headers, female pin headers, and box headers, giving engineers the flexibility to select the most appropriate connector style for their specific design requirements.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version