High-speed AOI systems said to raise standard for cost-effective inspections
30 November 2005Manufacturing / Production Technology, Hardware & Services
YESTech Europe, a leading supplier of automated inspection and yield enhancement systems for the electronics industry, introduced its new series of high-speed automated optical inspection systems at Productronica. The new F1 machine provides advanced automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts for improved quality and increased throughput.
The company says that its advanced Thin Camera technology enables electronics manufacturers to benefit from off-line tabletop PCB inspection with superior defect coverage. The F1 is equally effective for pre/post-reflow or even final assembly inspection, at line speeds not achievable in the past, it claims.
According to the company, the F1 provides complete inspection coverage with an extremely low false failure rate utilising new image processing technology that integrates several techniques, including colour, normalised correlation and rule-based algorithms. To enhance productivity, it was designed with an intuitive interface that offers fast, easy programming - operators typically take less than 30 minutes to create a complete inspection program, including solder inspection. The F1 uses a standard package library to simplify training and ensure program portability across manufacturing lines.
Inspection programs are compatible with the YESTech Formula series of in-line AOI systems. Remote programming maximises machine utilisation, while realtime SPC monitoring provides a valuable yield enhancement solution.
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