Microchip Technology has released to market its 24XX1025 family of I²C serial EEPROM devices with 1 Mbit of memory - claimed to be the highest memory density available for I²C serial EEPROM devices. These EEPROMs give designers working with I²C buses the freedom to add more memory to their system without major hardware or layout modifications. The family's page size, pinout, and signal and command structure are a natural extension of, or identical to, Microchip's 512 Kbit serial EEPROMs, providing an upgrade path. The feature page and byte write, write protection of the entire array, 1,8 V-5,5 V operation, and cascadeability. In addition they support up to one million erase/write cycles. The 24LC1025, 24FC1025, and 24AA1025 I²C serial EEPROMs are available in 8-pin PDIP and SOIC packages.
Low profile SMD antenna Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The Havok PCS.06.A antenna, from Taoglas, is a low profile SMD LTE/cellular 4G/3G/2G embedded antenna designed for direct SMD mount on a device PCB.
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DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
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DSP, Micros & Memory
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DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
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DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
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DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
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DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
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AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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