New lead-free, no-clean solder pastes to be launched
22 February 2006Manufacturing / Production Technology, Hardware & Services
A new, state-of-the-art, lead-free no-clean solder paste that promotes wetting and minimises defects with tin/silver/copper alloy soldering will be unveiled soon by the Circuit Materials Division (CMD) of Heraeus.
The new F640 Series line of solder pastes will be introduced to the microelectronics industry during the annual APEX show in Anaheim, California.
With its wide process window, the F640 Series of no-clean solder paste is able to compensate for process variations in printing, component placement and soldering, according to the company. It claims these lead-free pastes provide industry-leading wetting on a variety of surfaces and finishes and leave behind a clear residue. This reduces processing costs significantly, makes set-up easy and saves time. Offering minimal slumping and superior print-to-print consistency, the F640 Series can also be reflowed in air or nitrogen environments.
"These lead-free, no-clean solder pastes were tested extensively with our customers before being offered to the marketplace," says Brian Bauer, business manager for surface mount materials at Heraeus CMD. "These pastes are capable of providing near defect-free performance in the ever-changing production environment where reduction of hazardous substances (RoHS) and elimination of lead from the manufacturing process are a priority."
The Heraeus CMD is part of the W.C. Heraeus global enterprise that pioneered industrial technologies based on precious metals. Products include bonding wire, solder pastes, adhesives and fluxes; conductive adhesives; and a full line of lead-free products.
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