Interconnection


Connector system for high-speed interconnect

8 March 2006 Interconnection

The AirMax VS connector system from FCI is a comprehensive family of high-speed, lightweight, flexible, and scaleable connectors that suits a broad range of applications in data, communications, and industrial equipment.

The innovative system uses edge-coupling technology and an air dielectric between adjacent conductors to deliver high signal density with low insertion loss and low crosstalk, and it does this without the use of costly and space-consuming metal shields. According to the manufacturer, data rates can scale from 2,5 Gbps to beyond 12 Gbps without requiring redesign of a basic platform.

Co-planar signal, power, and guidance modules from the AirMax VS family are well-suited for use as Zone 3 interconnects in next-generation AdvancedTCA carrier-grade communications equipment. Zone 3 in an AdvancedTCA shelf allows for direct connection between an AdvancedTCA front board and a rear transition module (RTM) to route signals to the rear of an AdvancedTCA rack. AirMax VS right-angle signal modules easily enable these high-density connections. Up to four 150-position modules, each module supporting 50 differential pairs, can be placed side by side in Zone 3 to provide a total of 200 differential pairs.

In addition to superior electrical performance, they offer design versatility because signal connectors can be scaled by varying the number of columns of contacts, the number of contacts per column, and the column spacing. AirMax VS connectors also allow for mixed-pin assignments (differential or single-ended signals or power), to provide additional flexibility for system designers.

Co-planar power modules are also available to provide increased current-carrying capacity when needed. These are compact 12 mm-wide modules that use a 1 x 2 or 2 x 2 contact configuration rated to 80 A with 150 V voltage rating. Two available mating lengths for power receptacle contacts offer capability for sequential mating of power, ground, and signal contacts.

More information on the connector system can be seen at www.fciconnect.com/airmax.

For more information contact Quentin van den Bergh, Arrow Altech Distribution, +27 (0)11 923 9600, [email protected]



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
SoC brings scalable edge AI to life
Altron Arrow AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.

Read more...
Accelerate STM32-based IoT development with SPI EEPROM board
Altron Arrow Computer/Embedded Technology
ST Microelectronics’ ready-to-use STM32 expansion board helps design more efficient battery-friendly IoT devices based on ultra low power 32-Mbit Page.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Connectivity solutions for hydrogen technologies
Hiconnex Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.

Read more...
Mixed-density Combo-D connectors
Hiconnex Interconnection
Positronic’s SCBM connector series is a rugged, high-performance family of mixed-density D-sub connectors engineered for demanding environments.

Read more...
Same Sky expands rectangular connector portfolio
Future Electronics Interconnection
The portfolio includes male pin headers, female pin headers, and box headers, giving engineers the flexibility to select the most appropriate connector style for their specific design requirements.

Read more...
Generating negative voltages from a positive supply
Altron Arrow Editor's Choice Passive Components
It is common for IoT devices, industrial sensors, meters, and medical equipment to require both a positive and negative voltage, and this article explains the options available to produce a negative rail from a positive rail supply.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved