Interconnection


Micro-pitch interconnects save board area while providing spacing flexibility

8 March 2006 Interconnection

Samtec's line of sub-millimetre micro-pitch interfaces on 0,5 mm, 0,635 mm, and 0,8 mm pitch provide space and cost savings along with the proven performance features of traditional blade and beam construction.

0,5 mm pitch systems are available for the popular 5 mm board spacing (BTH/BSH Series) and for low profile applications (LTH/LSH Series) with a 2,31 mm mated height. The higher profile connector sets offer pin counts up to 360 in only 775 mm² of board space, while the lower profile options offer up to 100 I/Os in 185 mm² of board area.

For applications requiring slightly less density, Samtec offers its 0,635 mm pitch (QTS/QSS Series) and 0,8 mm pitch (BTE/BSE Series) systems. These products are available with up to 300 and 240 I/Os, respectively. Board spacing can range from 5 mm up to 19 mm for elevated applications.





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