High density interconnect arrays

17 May 2006 Interconnection AI & Data Analytics

The new Samtec SEARAY high density interconnects (SEAM/SEAF Series) provide a solid grid of contacts on 1,27 mm pitch and up to 500 I/Os. These connectors are the same footprint as the company's popular SamArray Series connector, but with added features and stack heights.

Lower insertion/extraction forces make the connector much more user-friendly and a choice of solder-crimps on the tails provide a choice of traditional tin-lead alloy or RoHS compliant tin-only for lead-free processing. Stack heights of 7 mm, 8,5 mm, and 10 mm are offered along with array sizes of 8 or 10 rows by 20, 30, 40, or 50 pins per row.

Pins may be routed single-ended or differentially in SEARAY connectors. Performance for the SEARAY at a -3 dB insertion loss is 4 GHz for single-ended applications and 9 GHz for differential pair applications. For dedicated differential applications, Samtec offers DP Array connectors (DPAM/DPAF Series) with performance of up to a terabit per connector with up to 168 useable signal pairs. The signal pairs are on a staggered grid to reduce the number of grounds as well as simplify signal routing on the boards.

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