Interconnection


Board-board with 0,9 mm stack height

17 May 2006 Interconnection

Continuous miniaturisation and increased component density on PCBs has created a demand for a very low profile connector on a 0,4 mm pitch that stacks at 0,9 mm high. Hirose's DF30 connector meets these demands and a complete range of connectors in 20, 22, 24, 30, 34, 40, 50, 60, 70 and 80 positions is available, making it suitable for virtually any application.

When mating, the two connectors will self align up to a dimension of 0,3 mm, and with an audible click that reassures one that the connector has fully engaged. The dual beam contacts also have a self-cleaning feature to enhanced contact reliability.

This connector series is supplied packaged in tape and reel for easy processing on the production line. Solder and flux wicking is totally eliminated by incorporating solder cavities and nickel barrier. It is ROHS-compliant.

DF30 is especially suited to portable electronics as it incorporates unique features that make it resistant to damage from the impact of being dropped.



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