Flex circuit board-to-board interconnect solutions offered
17 May 2006
Interconnection
Cinch Connectors has unveiled a solderless, board-to-board, compression style interconnection solution that blends the Cinch iQ connector with a flex circuit and compression system. Cinch's iQ Flex Circuit Assembly Solutions are designed for a variety of board-to-board applications, such as co-planar, parallel, stacked, multilevel and backplane boards.
To accommodate increased circuit density, functionality and performance in smaller and smaller packages, designers make use of three dimensions by connecting boards in parallel to one another. However, this makes interconnecting them a growing challenge.
Making it easier for designers to create multiboard solutions tailored to their exact requirements, the iQ Flex circuit assembly solution provides a number of I/O interconnects that range from less than 10 to over 400, the ability to match custom footprints, and offers a pitch as low as 1 mm.
The low-profile Cinch iQ technology offers low-self-inductance and low-resistance paths, allowing higher-speed signals. Also, the solderless compression system is said to be easy to use and permits fast rework.
www.cinch.com
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