Interconnection


iPass system offers storage industry increased speed and density

12 July 2006 Interconnection

Molex' low-profile iPass interconnect system offers the storage industry increased speed and high density. With both internal and external solutions, it features an extensive line of interconnects, cable assemblies and guide frames for wire-to-board applications. These include HBAs (host bus adapters), controller cards, servers, storage racks, switches, RAID (redundant array of independent discs) controllers devices and JBODs (just a bunch of disks) enclosures.

The complete offering accommodates the new SAS and SATA standards, as well as the External PCI Express (PCIe) and quad small form-factor pluggable (QSFP) standards. With speeds ranging from 1,5 to 6,0 Gbps, and the capability up to 10,0 Gbps, the manufacturer says that this system allows OEMs and integrators to build systems with the interconnect granularity and bandwidth that eliminates the need to invest in new connectors for generations to come. Also, users do not have to test and qualify two different families of connectors because the mating interface is the same for both internal and external applications, saving additional costs.

"With new standards in place, the demand for increased speeds is at an all-time high, challenging the storage industry to replace older parallel buses that cannot meet the new speed requirements," comments Jay Neer, marketing manager, Molex. "With the iPass Interconnect System, Molex is addressing the storage industry's need for a high-speed serial interface that meets the new industry standards and accommodates 10 Gbps and beyond, giving the OEMs and integrators the flexibility they need to grow with existing systems and lower their applied costs."





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