MPE-Garry's RoHS-compliant edgecard connectors have been designed for PCB thicknesses from 1,5 to 1,6 mm. Special versions are possible. The contacts are available as gold-plated or tinned versions.
Spacers at the bottom side allow a non-problematic 'pin and paste' soldering due to a high temperature resistant LPC material used. The plastic material fulfils UL 94 VO.
What’s the big deal with open pin fields? Spectrum Concepts
Interconnection
The concept behind the open pin field array is that it provides many contacts that are not limited to a single role.
Read more...New connector for Push-X technology Phoenix Contact
Interconnection
Phoenix Contact is extending the series of PCB connectors with innovative Push-X technology to include a new connector for conductor cross-sections up to 2,5 mm2.
Read more...Film and mica capacitors Actum Electronics
Passive Components
By utilising various polymer dielectrics plastics, Exxelia film and mica capacitors meet most technical requirements and serve all functions from standard filtering to specialised applications.
Read more...Test cable designed for maximum ruggedness Conical Technologies
Interconnection
The Anoison PT test cable is designed for maximum ruggedness using a high-quality raw cable, connector, and smart armouring module.
Read more...Safe connection under load Phoenix Contact
Interconnection
The ArcZero DC connectors from Phoenix Contact can be safely connected and disconnected under load, providing operators with reliable protection against hazardous electric arcs.
Read more...Time-To-Market interconnect solutions
Interconnection
TTM Technologies are at the forefront of electrified powertrains, vehicle charging stations, and energy storage solutions, providing thermal management, high-current capabilities, and specialised solutions.
Read more...Connectors for energy storage systems Phoenix Contact
Interconnection
The new Phoenix Contact BPC series connectors are protected against polarity reversal making them ideally suited for use in energy storage systems.
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