MPE-Garry's RoHS-compliant edgecard connectors have been designed for PCB thicknesses from 1,5 to 1,6 mm. Special versions are possible. The contacts are available as gold-plated or tinned versions.
Spacers at the bottom side allow a non-problematic 'pin and paste' soldering due to a high temperature resistant LPC material used. The plastic material fulfils UL 94 VO.
Read more...Clearing the Static: Ionisation equipment Actum Electronics
Circuit & System Protection
Electrostatic discharge (ESD) ionisation equipment is designed to neutralise static charges that accumulate on surfaces in environments where ESD-sensitive components or materials are handled. These ...
Read more...IO-Link compatible fibre-optic sensor Vepac Electronics
Interconnection
The DFS71 is a digital fibre-optic sensor with configurable outputs: single output with remote input, redundant, complementary, and classic, which can all be configured as PNP (source), NPN (sink), or push/pull.
Read more...High-performance connector
Interconnection
The CMM SMPM Series is the result of a collaboration between Nicomatic, a leader in connectors for harsh environments, and Radiall, an expert in RF coaxial connectors.
Read more...Multi-channel SMPM cable assembly RFiber Solutions
Interconnection
Withwave’s multi-channel SMPM cable assemblies provide a choice of 26,5, 40 or 50 GHz configurations based on precision array design and superior high-frequency cabling solutions.
Read more...M12 connectors with push-pull fast locking Phoenix Contact
Interconnection
Phoenix Contact’s push-pull fast-locking system, and the Push-Lock conductor connection, make assembly and installation effortless and reliable.
Read more...Connectors for automotive zonal architectures RS South Africa
Interconnection
Rosenberger H-MTD connectors form the basis for reliable and efficient data transmission now and for future automotive zonal architectures.
Read more...Narrow-body RF edge connectors Spectrum Concepts
Interconnection
These connectors compression mount to the printed circuit board instead of requiring solder, which results in increased signal integrity performance.