Manufacturing / Production Technology, Hardware & Services


Philips committed to environmental issues

4 October 2006 Manufacturing / Production Technology, Hardware & Services

Philips cooperates with leading suppliers and customers on a wide range of ‘green’ issues. Committed to environmental care, it was one of its factories that was the first in the world to receive ISO 14001 ­certification.

Its Eco Vision program and Eco-Design philosophy ensure that better products and more environmentally-friendly manufacturing processes lie ahead. And that includes both Pb- and halogen-free products.

Philips Semiconductors' has dubbed its own approach to environmental issues 'Profitable green'. It aims to reduce the environmental impact of its products while providing customers with leading-edge technology at the lowest possible cost.

In this article the company explains more about the 'lead-free' future.

The need to be lead-free

What is lead (Pb)?: Lead (or, in Latin; Plumbum, Pb) is a metal with a long application history. In fact, the word 'plumber' is derived from the Roman use of lead pipes for carrying water. However, when absorbed by the human body, lead is a cumulative poison detrimentally affecting health in several ways. In children, lead can impede brain development, making them particularly vulnerable to lead poisoning.

Throughout the electronics industry, the desire for Pb-free electronics is a hot topic. Customers and manufacturers alike are keen to ensure that new regulations in Europe, the US and Far East are complied with, sooner rather than later:

* In Europe, the EU directive on Restrictions on the use of Hazardous Substances (RoHS) includes a requirement to eliminate Pb in electronics, in all but special applications, by 1 July, 2006.

* In China, the government is working on bringing in similar legislation to the Europeans.

* In Japan, electronic waste and recycling laws oblige manufacturers to eliminate or recover their waste products containing Pb.

* In the United States, laws banning or restricting the use of Pb are coming for many products and there is an increasing demand for a total ban.

The electronics industry is now focused on Pb-free assembly processes and the issues concerning the higher temperatures needed for both reflow and wave Pb-free soldering. By investing heavily in research, Philips has developed cost-effective Pb-free manufacturing processes that guarantee the reliability of its components. Moreover, it is being proactive in also looking into solutions for devices where Pb is contained inside the package: replacing Pb-based solders in some multichip modules/SiPs with new glues, for example.

Is lead hazardous towards our environment? Today lead piping is obsolete and the largest use is in car batteries. Though these are small quantities, sheer volume of electronic consumer goods produced today means there is a risk of lead contaminating drinking water, plants and animals - for example, by acid rain filtering through landfill sites - and that is a concern to all of us.

Legislation: Formal guidelines have been introduced gradually over several years by various bodies, substantiating Philips' own drive to eliminate lead from electronic products. Two of the most recent and important directives - WEEE (Waste from Electrical and Electronic Equipment) and RoHS (Restriction of Hazardous Substances) - impose better control over waste management of electronic equipment. Of most relevance to component manufacture, the RoHS establishes phase-out dates for Pb - along with several other materials - from electronic products. This means that effective 1 July 2006, amounts of lead and the other named materials contained in electronic products must be below certain limits (unless exempt by special rule).

What is the definition of lead-free? Content less than 100 ppm Pb by weight (E3).

What is the definition of green/RoHS? The product complies to RoHS (Restriction of use of Hazardous Substances) legislation.

Do lead-free products have any impact on shelf life? No. Guaranteed shelf life remains the same as for current SnPb products.

Are Philips products lead-free? Although numerous products have been lead-free for a number of years, Philips is now ensuring all its products are converted to lead-free materials.

For more information contact Philips Semiconductors, +27 (0)11 471 6000.





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved