Passive Components


MEMS microphones improve voice quality for mobile electronic devices

1 November 2006 Passive Components

Anyone who has tried to make a cellphone call at a train station or airport knows the problem: announcements over the PA system and the sound of incoming trains or planes make it nearly impossible for the person on the other end of the line to hear clearly what is being said.

The breakthrough with micro-electro-mechanical systems (MEMS) technology in electroacoustics, is eliminating misunderstandings: MEMS microphones can be precisely aimed at the voice source, and they filter out unwanted background noise - which is ideal for those who use PDAs with speech recognition, notebooks with IP-telephony, or digital cameras with audio recording capabilities.

Besides their excellent voice quality, MEMS microphones also have an edge over conventional electret condenser microphones (ECMs) because they require less space and they are not sensitive to the high temperatures that arise in PCB production. Last year, according to The Information Network, 5% of all the microphones sold were based on MEMS technology. By 2008, their market share will be 15%. The current global market volume of 130 million US dollars is expected to rise to 680 million US dollars by 2010 with an annual growth rate of 62%.

With its 'World of MEMS' forum, electronica 2006 is - within the framework of electronica MicroNanoWorld in Hall A2 - spotlighting the development of MEMS microphones and other applications for micro-electromechanical systems. Examples of such applications include 'micro pumps' for cooling computer chips, micro fuel cells, pressure measurement devices implanted in heart vessels, lab-on-chip 'mini laboratories' for rapid analysis of substances, and acceleration sensors for controlling airbags.

This comprehensive forum is covering all areas related to these small systems: MEMS sensor technology, RF MEMS, micro-opto electromechanical systems (MOEMS), bio MEMS, and nano-opto electromechanical systems (NEMS), as well as packaging.

At electronica 2006 from 14-17 November in Munich, the 'World of MEMS' forum within the framework of MicroNanoWorld (www.electronica.de/micronanoworld) in Hall A2, will show the big trends for tiny electronic systems.





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