Tyco Electronics has brought out one of the smallest two-piece PCB connectors.
The Tyco Mini Match is a high density board-to-board connector with a 2,5 mm pitch. The housing is made of polyester according to UL 94 V-O. The tin-plated contacts grip with high contact pressure, and overstress protection is integrated.
New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Robust series of vertical-mating battery connectors Electrocomp
Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.
Read more...High current and voltage interconnect Hiconnex
Interconnection
The 972 series interconnect from Glenair ensures peak performance for the latest specification requirements in high-current, high-voltage, and high-frequency commercial aircraft applications.
Read more...M12 panel mount connectors Communica
Interconnection
Binder, a specialist in industrial circular connectors, offers a particularly wide range of M12 panel mount connectors that cover a wide variety of connection types, materials, and fastening solutions.
Read more...Low-profile tantalum chip capacitors Electrocomp
Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.
Read more...Compact high-performance antennas Electrocomp
Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX offers a variety of extremely compact and high-performance internal, on-board, multiprotocol 2,4 GHz antennas ideal for use in SiP applications.
Read more...Blade terminals deliver greater power density Spectrum Concepts
Interconnection
[Sponsored] Connectivity has become more important as designers pack more power into smaller spaces, all while managing thermal loads and ensuring efficiency.
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