Aries Electronics has introduced a new CSP test socket for devices from 28 mm² to 40 mm². The new socket is ideal for manual testing of devices with pitches down to 0,40 mm, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices.
The socket provides minimal signal loss for higher bandwidth capability via a signal path of only 1,95 mm. The socket's overall size of 77,47 x 63,50 x 32,28 mm provides the maximum allowable space for board components and connectors.
The 4-point spring probe crown on the socket ensures 'scrub' on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs and other device types. The compression spring probes are heat-treated beryllium copper alloy, plated with 0,75 μm gold per Mil-G-45204 over 0,75 μm nickel per QQ-N-290. The socket's moulded components are UL94V-0 PEEK and/or Ultem. All hardware is stainless steel.
Contact forces of the sockets are 16 g per contact for 0,40 mm pitch and 25 g per contact for 0,50 mm pitches and larger. Operating temperature is -55 to 150°C. Estimated contact life is over 500 000 cycles.
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