YESTech's YTV B3 is an off-line benchtop PCB inspection automated optical inspection (AOI) system that uses advanced 'Thin Camera' technology to offer exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Programming the B3 is fast and intuitive. According to the company, operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The B3 uses a standard package library to simplify training and ensure program portability across manufacturing lines. Programs created with the B3 are also compatible with YESTech's complete line of AOI systems.
Newly available Fusion Lighting and advanced image processing technology integrates several techniques, including colour, normalised correlation and rule-base algorithms, to provide complete inspection coverage with an extremely low false failure rate. The B3 is equally effective for pre/post-reflow or even final assembly inspection. Remote programming maximises machine utilisation and realtime SPC monitoring provides a valuable yield enhancement solution.
The YTV B3 AOI offers inspection for: solder and lead defects; component presence and position; correct part; polarity; through-hole parts; and paste.
For more information contact John Watson, Test & Rework Solutions, +27 (0)11 708 3451, [email protected]
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