New packaging for all SPI and I²C EEPROMs

2 May 2007 DSP, Micros & Memory

All of STMicroelectronics' serial EEPROM devices, from 2 to 64 Kbit density - and from both the SPI and I²C interface series - are now available in the tiny 2 x 3 mm MLP8 package, compared to the predecessor 4 x 5 mm S08N package. ST says it is the first in the market to offer a comprehensive 'low-density' serial EEPROM range in such a small package. The ultra-thin (0,6 mm), fine-pitch, dual flat 2 x 3 mm MLP delivers important improvements compared to other packages, and the families offer footprint compatibility throughout the range from 2 to 64-Kbit density. These tiny memory chips, in the M24 (I C bus interface) and M95 (SPI bus interface) families, operate over a wide supply-voltage range, from 1,8 to 5,5 V, and are specified to function for more than one million Write cycles and to retain data for more than 40 years.

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