New packaging for all SPI and I²C EEPROMs
2 May 2007
DSP, Micros & Memory
All of STMicroelectronics' serial EEPROM devices, from 2 to 64 Kbit density - and from both the SPI and I²C interface series - are now available in the tiny 2 x 3 mm MLP8 package, compared to the predecessor 4 x 5 mm S08N package. ST says it is the first in the market to offer a comprehensive 'low-density' serial EEPROM range in such a small package. The ultra-thin (0,6 mm), fine-pitch, dual flat 2 x 3 mm MLP delivers important improvements compared to other packages, and the families offer footprint compatibility throughout the range from 2 to 64-Kbit density. These tiny memory chips, in the M24 (I C bus interface) and M95 (SPI bus interface) families, operate over a wide supply-voltage range, from 1,8 to 5,5 V, and are specified to function for more than one million Write cycles and to retain data for more than 40 years.
Further reading:
Redefining entry-level MCUs
NuVision Electronics
DSP, Micros & Memory
The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.
Read more...
Microchip enhances TrustMANAGER platform
Altron Arrow
DSP, Micros & Memory
Firmware over-the-air updates and remote cryptographic key management provide scalable solutions for addressing IoT security challenges.
Read more...
MCU for low-power, IoT applications
NuVision Electronics
DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.
Read more...
EEPROMs for industrial and military markets
Vepac Electronics
DSP, Micros & Memory
Designed to ensure the data retention and the secure and safe boot of digital systems, the memory product line includes small and medium density EEPROMs from 16 kb to 1 Mb.
Read more...
PLCnext – Open, IIoT-ready industrial platform
IOT Electronics
DSP, Micros & Memory
PLCnext can be used alongside an existing PLC system, collecting control system data via EtherNet/IP, PROFINET, or MODBUS, and can push this information to a cloud instance.
Read more...
ICs vs modules: Understanding the technical trade-offs for IoT applications
NuVision Electronics
Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.
Read more...
Hardware quantum resistance to embedded controllers
Avnet Silica
DSP, Micros & Memory
To help system architects meet evolving security demands, Microchip Technology has developed its MEC175xB embedded controllers with embedded immutable post-quantum cryptography support.
Read more...
High-performance processor for edge-AI
Altron Arrow
DSP, Micros & Memory
The STM32MP23 microprocessor from STMicroelectronics is the latest addition to the STM32MP2 series, designed to meet the demands of industrial, IoT, and edge AI applications.
Read more...
PolarFire SoC FPGAs achieve AEC-Q100 qualification
ASIC Design Services
DSP, Micros & Memory
Microchip Technology’s PolarFire SoC FPGAs have earned the Automotive Electronics Council AEC-Q100 qualification.
Read more...
Integrated STM32WBA6 wireless microcontrollers
Altron Arrow
DSP, Micros & Memory
Cost-efficient and highly integrated embedded controllers for emerging 2,4 GHz wireless applications in smart home, health, factory, and agriculture.
Read more...
printer friendly version