The entire line of high-frequency centre probe test sockets from Aries Electronics can now be used with devices requiring pitches as low as 0,40 mm.
The sockets are used in applications such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices with speeds from 1 GHz to more than 10 GHz.
These high-frequency centre probe test sockets can be easily mounted to, and removed from, the test board because of their solderless, pressure-mount compression spring probes. The 4-point spring probe crown on these sockets ensures 'scrub' on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs and other socket types. Single point probes are available, if needed, for small land area contact pads for LGAs, QFNs, MLFs, etc. The socket's gold-over-nickel plated compression spring probes leave very small witness marks on the bottom of the device solder balls.
Four socket sizes are offered: for device packages up to 13 mm², from 14 mm² to 27 mm², from 28 mm² to 40 mm², and from 41 mm² to 55 mm². Each socket's small overall profile allows the maximum number of sockets per board, and boards per oven, while at the same time being operator friendly. In addition, these sockets provide minimal signal loss for higher bandwidth capability via a signal path of only 1,92 mm.
The compression spring probes in Aries' new RF sockets are heat-treated beryllium copper alloy, plated with 0,75 μm gold over 0,75 μm nickel. Operating temperature is -55 to 150°C and estimated contact life is more than 500 000 cycles.
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