Interconnection


Elevated high density arrays

16 May 2007 Interconnection

Samtec’s new HD Mezz elevated high density interconnects, the HDAM/HDAF Series, provide a solid grid of contacts on 1,2 mm x 2 mm pitch with up to 299 signals/grounds or 92 signal pairs.

These connectors are initially being offered with 20 mm, 25 mm, 30 mm and 35 mm stack heights with other sizes under development and application specific stack heights available for nominal tooling cost.

The open pin field design allows the connector to be routed single-ended or differentially. Final Inch Breakout Region Performance Certified printed circuit board layout models are available with performance of up to 3,4 GHz single-ended and up to 4,4 GHz per differential pair depending upon stack height and the signal-to-ground ratios used in the design.

HD Mezz and SEARAY (SEAM/SEAF Series open pin field array) are available from both Samtec and Molex.



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