Computer/Embedded Technology


Fanless SBC has innovative heatsink design

30 May 2007 Computer/Embedded Technology

IEI's Wafer-8522G2 is the first Celeron M 1 GHz based fanless solution using the new innovative heatsink solution from IEI.

With an advanced micro architecture and 1 GHz core frequency, the ULV Intel Celeron M Processor is an ideal solution for scalable embedded computing such as communications, transaction terminal and industrial automation applications. While incorporating new features and improvements, it remains software-compatible with previous members of the Intel microprocessor family.

The Intel 852GM chipset with a 400 MHz system bus and integrated 32-bit 3D core at 133 MHz is an optimised integrated graphics solution for embedded computing. It features a low-power design and can support up to 1 GB DDR 200/266 system memory.

The entire case can help spread out heat. Heat can pass through the heatsink to the whole chassis. It also keeps a cool space in the middle of the system to extend the product life cycle of the devices including the system like HDD or LCD panel.

Other features include TPM 1.2 software architecture, six COM ports and Dual GbE.



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