Silicon Storage Technology has unveiled its All-in-OneMemory solution, said to be a revolutionary memory subsystem that blends key benefits of NOR, NAND, and RAM in a unified architecture that offers multigigabyte of execute-in-place (XIP) code storage and satisfies the growing data storage needs of embedded applications. The technology will provide a completely-managed memory subsystem for a wide range of embedded system applications. By managing the system's key memory components in a single package, it simplifies the host interface, shortens design time, reduces overall system costs, and improves quality and reliability, according to the manufacturer. All-in-OneMemory consists of a memory controller with built-in user NOR, NAND flash and RAM, all housed in a single package. By intelligently managing all memory components with a resident 32-bit microcontroller, it offers instant secure boot, memory demand paging, NAND flash management, and a standard ATA data storage protocol in a small footprint package.
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DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
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Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
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DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
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Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
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DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
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AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
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DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
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