14 February 2001Manufacturing / Production Technology, Hardware & Services
Weller offers hot air devices that are suitable for soldering and desoldering the smallest components up to large SMD components.
Soldering with hot air does not take place with conventional solder but uses soldering paste. The solder paste is applied to the solder joints by suitable dispensers and then a noncontact soldering process is performed by hot air.
When desoldering with hot air, some special precautions need to be observed. Smaller components are heated up evenly with the hot air pencil and then lifted up by means of integrated vacuum. A diverse range of nozzles is available for desoldering larger components. Here, initially in standby mode, the component body is preheated gently with contact heat via a plate installed in the nozzle. Then the full heat output is switched on with a higher air flow for just a few seconds. The air flow is conducted exactly to the leads of the components due to the design of the nozzle.
The component can then either be lifted up with the built-in vacuum (WHA 700/WHA 2000) or, for example, with a vacuum maniplulator. The vacuum is adjusted so that the component can be lifted, but there is no danger at all of any pads detaching from the PCB due to excessive tensile force. Thus desoldering with hot air proves to be gentle to both the component and to the PCB, preventing either thermal or mechanical damage.
Weller offers a variety of hot air stations to suit different requirements.
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