Blade headers for high current densities

3 October 2007 Interconnection

Designed for high current-density applications, Molex's Micro-Max Power header is soldered directly to PCBs such as a voltage regulator module (VRM) or a mother-board using a slotted via. With a current rating of 16,0 A per blade at 30° T-rise, Micro-Max Power may be used in any board-to-board application where power transfer is needed through a non-separable interface in a compact design.

Micro-Max Power headers are available in circuit sizes ranging from 4-to-24 blades in a single-row configuration. Optional voided circuits are available to allow for use in high-voltage applications.

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