Telecoms, Datacoms, Wireless, IoT


Microwave Office 2007 released

31 October 2007 Telecoms, Datacoms, Wireless, IoT

Applied Wave Research has announced the 2007 versions of its high-frequency software, the Microwave Office design suite and its system simulation software, Visual System Simulator (VSS). These latest releases provide unique and innovative new software capabilities that help designers deliver next-generation communications products with a higher degree of confidence in less design cycle time.

New in Microwave Office is an advanced circuit extraction technology, said to be an industry first, developed specifically to deliver productivity benefits to designers of complex, next-generation communications products. ACE (automated circuit extraction) is said to reduce from hours to seconds the time required to do the initial modelling of complex interconnects because users are able to leverage layout-based models for circuit extraction. This innovative approach to circuit extraction enables designers to perform interconnect modelling quickly and accurately at the earliest stages of the design flow, where problems can be identified and corrected before costly and time-consuming redesigns are required. These benefits ensure that products will be volume-manufacturable and cost-effective, and will achieve their market window of opportunity.

VSS 2007 software now includes RFA technology, an advanced system-level RF architectural planning and specification tool for RF communication system engineers who need to quickly create and verify the initial specifications of a radio design before committing to hardware and/or a particular circuit design. RFA offers a new simulation tool, RF Inspector, which helps designers find potential pitfalls early in the design process at the system-level design phase, thus saving significant design cycle time and costly re-spins. Users can identify sources of intermodulation products and undesired spurs of an RF link, including the effects of conversions, harmonics and noise. This enables users to isolate the sources of unwanted interference and to better design their RF systems. It is designed to support both tone and modulated signals, and it is integrated seamlessly into Microwave Office 2007 design suite.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Wi-Fi 6 and Bluetooth LE co-processor
Altron Arrow Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.

Read more...
Improving accuracy of outdoor devices
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.

Read more...
New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
Next-level Software Defined Radio
IOT Electronics Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.

Read more...
High-performance Zigbee and BLE module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.

Read more...
Championing local PCB manufacturing
Master Circuits Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.

Read more...
How IoT-driven smart data helps businesses stay ahead
Trinity IoT Telecoms, Datacoms, Wireless, IoT
With around 19 billion IoT devices globally, embedded in everything from machinery to vehicles to consumer products, reliable data is plentiful.

Read more...
IoT-optimised LTE Cat 1 bis module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.

Read more...
Chip provides concurrent dual connectivity
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.

Read more...
The 6 GHz band radio solution
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Analog Devices’ 16 nm transceiver family offers a highly integrated solution for this new frequency band, featuring low power consumption and high performance.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved