ESD protection for display, camera and USB interfaces
31 October 2007
Circuit & System Protection
The introduction of multimedia services in 3G phones is driving the increase in resolution of graphic displays and multiformat data exchange and storage. As a result, the parallel interfaces between displays and camera modules to the baseband or multimedia processor, via the flex cable, become tough cabling and EMI constraints. To solve this issue, several specifications of high speed serial interfaces have been introduced.
STMicroelectronics has introduced a new family of low line capacitance ESD protection which break the 1 pF barrier. These devices ensure a high level of signal integrity without compromising the protection of sensitive chips against the most stringently characterised ESD strikes.
The DSILC6-4xx device offers 15 kV ESD protection to four data lines. It has a 2,5 pF maximum line-to-GND capacitance and 1,25 pF maximum line-to-line capacitance. It is available in SOT-666 and Flip-Chip packages, with ultra-small package thickness of just 0,6 mm. This device is compliant with MDDI, SMIA and MIPI specifications, and offers no insertion loss up to 2,0 GHz.
The USBULC6-2M6 device protects two data lines against ESD up to 15 kV and is high speed USB specification compliant up to 480 Mbps. It boasts 1 pF maximum line-to-GND capacitance and 0,5 pF maximum line-to-line capacitance. This device provides integrated protection of the VBUS, with no insertion loss up to 5,0 GHz. It is available in a micro leadless package taking up PC board surface area of 1,5 mm² with a thickness of 0,6 mm.
The USBULC6-2F3 provides 15 kV ESD protection to two data lines and has a 1,2 pF maximum line-to-GND capacitance. It offers leakage current less than 100 nA for longer operation of battery powered devices. It is high speed USB specification compliant up to 480 Mbps, provides no insertion loss up to 7,0 GHz and is available in a highly integrated Flip-Chip package of size 0,9 mm² with 0,4 mm pitch.
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