Variety of one-piece interface solutions
5 March 2008
Interconnection
Samtec one-piece interfaces are ideal for high shock/vibration applications due to their robust design with threaded inserts to mount the connectors to the boards. They can also improve quality over elastermeric systems in pin-and-socket systems due to more reliable connections and elimination of bent pins. They also provide low cost board stacking through low system cost by reducing the number of components required to be purchased and processed.
Dual row interfaces on 1 mm pitch (FSI Series) provide a range of board spacings from 3 mm to 10 mm between boards. For ultra low profile applications on 1 mm pitch, the SEL Series provides 0,64 mm and 1,27 mm board spacings while the SEI Series provides 1,65 mm board spacings. High density array interconnects (GFZ Series) can achieve up to 1200 I/Os and a 3 mm board spacing profile.
Specialty applications on 2,54 mm pitch include one piece power interfaces (OPP Series), traditional strip style interfaces (SIB Series), and single and double row one-piece Pogo style interface strips (PGP Series).
For more information contact Samtec, +27 (0)11 454 4317, africa@samtec.com, www.samtec.com
Further reading:
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Interconnection
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Interconnection
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