RF Micro Devices has announced the introduction of its patent pending MicroShield Integrated RF Shielding technology. This technology is said to eliminate the need for bulky and costly external shields by integrating RF shielding directly into the RF IC or module. In doing so, it can reduce the height and volume requirements for RF sections by up to 25% and 50%, respectively, and provides customers with components that are insensitive to board placement.
RF shielding reduces emissions related to electromagnetic interference (EMI) and radio frequency interference (RFI) and minimises susceptibility to external fields. Traditional RF shielding is implemented with external metal 'cans' that encapsulate and shield the RF section of a circuit board. However, this implementation is costly and time consuming, as the cans used for RF shielding must be customised according to individual circuit boards. Additionally, external RF shields increase the space requirements for RF sections and, more significantly, can degrade the performance of the underlying RF circuitry. This performance degradation leads to a time-consuming retuning process that is necessary to counter the effects of the external shield.
MicroShield technology reduces the impact of EMI and RFI by minimising exposure to external fields and preventing energy leakage into unwanted areas of the host device. Also, by eliminating sensitivity to board placement, it eliminates the risk of circuit retuning, thereby accelerating time-to-market and reducing the cost of RF implementation.
Wi-Fi 6 and Bluetooth LE co-processor Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.
Read more...Improving accuracy of outdoor devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.
Read more...New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Next-level Software Defined Radio IOT Electronics
Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.
Read more...High-performance Zigbee and BLE module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.
Read more...Championing local PCB manufacturing Master Circuits
Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.
Read more...IoT-optimised LTE Cat 1 bis module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version