Semiconductors in TO 220 and TO 218 case designs are usually secured to the selected heatsink by means of a screwed connection for the requisite cooling. This results in spot contact pressure in the area of the securing flap.
On the other hand, the contact pressure on the underside of the semiconductor, ie, where the primary heat is emitted, is lower. This in turn gives rise to an increased heat transmission resistance from the semiconductor to the heatsink in this area - so-called 'hot spots'.
The new contact pressure heatsinks in the AK 350 and AK 352 ranges from Alutronics are designed in such a way that when screw-connected, they distribute the contact pressure to the main heatsink across the entire surface of the underside of the semiconductor.
Dimensional tolerances on the part of the semiconductor casing are largely offset by the design of the heatsinks. In addition to optimising the contact pressure and reducing the contact resistance, these contact pressure heatsinks also provide additional cooling of the components across the top where the heatsinks can also be mounted as individual heatsinks.
The main application is in areas where safe assembly and optimised heat transmission from the semiconductor to the heatsink is required. The new heatsinks in the AK 350 and AK 352 ranges are designed for individual assembly as standard. Special dimensions are also available on request, for example for multiple assembly.
Coupled inductor for high-performance applications
Passive Components
This coil with MnZn core is characterised by its high permeability and extremely low RDC values, which achieves excellent power density and very high efficiency.
Read more...Power inductors iCorp Technologies
Passive Components
he HTF-MP series is more suitable for complex multiphase power supply applications in design, effectively meeting the needs of ultra-thin and high-power devices.
Read more...SMT power inductors Future Electronics
Passive Components
The Würth Elektronik WE-MXGI SMT power inductors are the latest addition to Würth Elektronik’s moulded power inductor series, engineered for high-frequency power applications.
Read more...Large capacitance MLCCs at 100 V RS South Africa
Passive Components
TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors to 10 µF at 100 V in 3225 size.
Read more...Film and mica capacitors Actum Electronics
Passive Components
By utilising various polymer dielectrics plastics, Exxelia film and mica capacitors meet most technical requirements and serve all functions from standard filtering to specialised applications.
Read more...Power-over-coax inductors RS South Africa
Passive Components
TDK has expanded the ADL3225VF series of wire-wound inductors for automotive power-over-coax (PoC).
Read more...Thick film power resistors Electrocomp
Passive Components
Vishay has released a new product to the market, its thick film power resistor, which is offered in a clip-mount TO-247 package.
Read more...Compact EMI suppression capacitors RS South Africa
Passive Components
These new components from TDK are 20% smaller than previous models and meet Grade III Test B standards for temperature, humidity, and bias.
Read more...HiRel components from Kyocera AVX Electrocomp
Passive Components
Kyocera AVX Corporation is a leading supplier of advanced components and interconnect solutions, offering a broad selection of passive components and connectors.
Read more...Tiny power inductor for low noise applications iCorp Technologies
Passive Components
With the evolution of Bluetooth, chips, sensors and other technologies, the design of TWS earphones is becoming smaller and thinner, and the performance and size requirements of integrated inductors need to follow suit.
printer friendly version