Semiconductors in TO 220 and TO 218 case designs are usually secured to the selected heatsink by means of a screwed connection for the requisite cooling. This results in spot contact pressure in the area of the securing flap.
On the other hand, the contact pressure on the underside of the semiconductor, ie, where the primary heat is emitted, is lower. This in turn gives rise to an increased heat transmission resistance from the semiconductor to the heatsink in this area - so-called 'hot spots'.
The new contact pressure heatsinks in the AK 350 and AK 352 ranges from Alutronics are designed in such a way that when screw-connected, they distribute the contact pressure to the main heatsink across the entire surface of the underside of the semiconductor.
Dimensional tolerances on the part of the semiconductor casing are largely offset by the design of the heatsinks. In addition to optimising the contact pressure and reducing the contact resistance, these contact pressure heatsinks also provide additional cooling of the components across the top where the heatsinks can also be mounted as individual heatsinks.
The main application is in areas where safe assembly and optimised heat transmission from the semiconductor to the heatsink is required. The new heatsinks in the AK 350 and AK 352 ranges are designed for individual assembly as standard. Special dimensions are also available on request, for example for multiple assembly.
PCB connectors for power systems Phoenix Contact
Passive Components
With the new PC 6 PCB connectors with screw connection, Phoenix Contact’s classic connection technology is available with enhanced touch protection for the new pin connector pattern.
Read more...SPE connector range Phoenix Contact
Passive Components
Single Pair Ethernet (SPE) is a communication technology that realises Industry 4.0 and IIoT applications, and Phoenix Contact’s Combicon range are ideal for SPE connections.
Read more...TDK expands MLCC series RS South Africa
Passive Components
TDK Corporation has expanded its CGA series of multilayer ceramic capacitors, currently being the highest capacitance in 100 V products for automotive applications.
Read more...Inductor supports temperatures up to 150°C RS South Africa
Passive Components
TDK has launched a highly durable inductor for automotive A2B applications that supports a wide temperature range of -55 up to 150°C.
Read more...Long-range passive infrared motion sensor Future Electronics
Passive Components
Panasonic Industry (PaPIRs) recently introduced he world’s most compact long-range passive infrared motion sensor, for installation heights of up to 15 metres.
Read more...Isolated solid state relay Altron Arrow
Passive Components
The ISO808, ISO808-1 (PowerSO-36) and ISO808Q, ISO808Q-1 (TFQFPN32) are galvanic isolated eight-channel drivers featuring a low supply current.
Read more...Low-profile power inductors RS South Africa
Passive Components
TDK Corporation has announced the introduction of its new PLEA85 series of high-efficiency power inductors developed for battery-powered wearables and other devices.
Read more...Miniature capacitor for automotive applications Avnet Abacus
Passive Components
Murata has released its LLC series of multi-layer ceramic capacitors for automotive applications, that feature a reversed termination for low ESL.
Read more...Sealed tantalum capacitors Electrocomp
Passive Components
With an operating temperature range of -55 to 125°C, with voltage derating, these capacitors have been designed especially for avionics and aerospace applications.