Sunlord’s Multiphase Co-Fired power inductor HTF-MP series has upgraded the single-phase HTF-H products in terms of integrated applications. Compared with the single-phase HTF-H series, the HTF-MP series is more suitable for complex multiphase power supply applications in design, effectively meeting the needs of ultra-thin and high-power devices, such as high-performance computing platforms and low-profile electronic devices.
Thanks to the innovative structural design, the HTF-MP series inductor demonstrates its unique and powerful advantages:
• Compared with assembled inductors, it has no acoustic noise, lower EMI, and lower losses.
• Compared with traditional moulded inductors, it has higher magnetic permeability and better DCR.
• Compared with HTF-H inductors, it has higher integration and saves more space.
These inductors are highly reliable and provide high saturation current. By being highly integrated, they reduce the component count thereby saving space on the board layout. They are ideally suited for applications in VRM and TLVR power supplies for AI server CPUs and GPUs, and in power supplies for industrial equipment and base stations.
Improving accuracy of outdoor devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.
Read more...High-performance Zigbee and BLE module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.
Read more...IoT-optimised LTE Cat 1 bis module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.
Read more...Module for smart city and smart utility devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has launched the Quectel KCM0A5S, a high-performance Wi-SUN module designed for smart applications such as street lighting, precision agriculture, industrial IoT, smart meters and smart cities.
Read more...Cutting-edge hybrid capacitors Avnet Silica
Passive Components
Panasonic Industry recently announced the launch of the ZVU Series Hybrid Capacitors, a cutting-edge solution tailored to meet the escalating demands of advanced electronic systems.
Read more...What is Wi-Fi HaLow and why choose it for IoT? iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.
Read more...Low-profile tantalum chip capacitors Electrocomp
Passive Components
These general-purpose tantalum capacitors from Kyocera AVX are available in multiple case sizes with low profile options.
Read more...Wi-Fi in 2025: When is Wi-Fi 7 the answer? iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Wi-Fi 7 introduces multi-link operation and lower latency, a game-changing feature that allows devices to transmit and receive data across multiple frequency bands simultaneously to significantly reduce network congestion.
Read more...High-accuracy positioning iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has recently announced its LG580P, a multi-constellation, multi-band GNSS module designed for high-precision positioning that supports multi-band signals across L1, L2, L5, and L6.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.