By combining the math of PHY processing with the logic of MAC processing onto a single chip, Texas Instruments has advanced the functionality of digital signal processors (DSPs) for complex, multiprocessing beyond 3G cellular infrastructure applications such as HSPA/HSPA+, LTE and WiMAX Wave 2. This new single-core 1 GHz DSP also delivers high data throughput and reduced latency for high quality of service, and potentially eliminates the need for a costly RISC co-processor.
By nature, DSPs are exceptional tools for performing the same math task repeatedly at very high speeds. However, their functionality is generally limited when the task requires logic, a function typically performed by a hardwired co-processor with customised software to perform the task. By enhancing the memory and cache performance, coupled with the high-performance TMS320C64x+ core, the new TMS320TCI6484 DSP reaches high levels of functionality. It also includes additional high performance accelerators and peripheral interfaces which are optimised for cellular infrastructure products.
Efficient MAC-layer processing in wireless base-stations hinges upon available memory and rapid access to stored data. The TCI6484 designers boosted the Level 2 cache memory by 4x versus previous generations. The larger on-chip cache memory stores frequently used instructions, keeping them closer at hand and eliminating the time spent accessing data stored on slower, external memory.
Data that is stored externally can be accessed faster than previous chips with the double data rate (DDR2) memory interface. Faster access reduces latency - a major obstacle for data-intensive applications such as realtime conferencing and streaming media. Not only is latency reduced but the TCI6484 supports symbol rate processing at 34 Mbps, making it an ideal platform for high-density, low-cost base-stations. The chip supports symbol rate processing needed for multiple sectors or carriers for multiple air interfaces including GSM-EDGE, Evolved EDGE, WCDMA, HSPA/HSPA+, TDS-CDMA, WiMAX Wave 2 and LTE.
The TCI6484 leverages the same 1 GHz TMS320C64x+ core found in other DSPs from TI, making it code compatible with previous generations. TI also offers optimised software libraries for WiMAX Wave 2, LTE and HSPA+. These libraries enable higher channel density as well as lower power per channel. System level testing can be accomplished with a hardware development card that supports two TCI6484 devices.
Memory shortage 2026: Engineering implications for South Africa
DSP, Micros & Memory
[Sponsored] Addressing this challenge requires system-level thinking and adoption with McKinsey Electronics providing the engineering and sourcing framework required to maintain system resilience despite ongoing global constraints.
Read more...Cost-effective microcontroller series Altron Arrow
DSP, Micros & Memory
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.
Read more...Battery-friendly Thread and BLE solution iCorp Technologies
DSP, Micros & Memory
Positioned as an incremental upgrade to the ESP32-H2, Espressif’s ESP32-H21 adds an integrated DC-DC converter that reduces active current draw and helps extend battery life in power-sensitive consumer and industrial devices.
Read more...Next-gen robotic systems initiative EBV Electrolink
Design Automation
EBV Elektronik recently introduced MOVE – Driving Robotics Forward, a new initiative designed by EBV Elektronik‘s Embedded Solutions team to support the development of next-generation robotic systems.
Read more...Next generation HMI processing platform Future Electronics
DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.
Read more...Compact high-current power inductor EBV Electrolink
Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.
Read more...Low-power SoC for IoT designs iCorp Technologies
DSP, Micros & Memory
Espressif’s ESP32-H4 is a dual-core 32-bit RISC-V SoC designed for battery-powered wireless products that require low energy consumption, strong security, and modern connectivity.
Read more...Chip for high-density power Future Electronics
DSP, Micros & Memory
Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography.
Read more...The end of ‘entry-level’: STMicroelectronics’ STM32C5 sets a new baseline for embedded systems
DSP, Micros & Memory
[Sponsored] Instead of incrementally improving legacy Cortex-M0+ architectures, STM32C5 introduces a Cortex-M33-based platform into the entry-level category. This changes not only performance expectations, but also how engineers approach system architecture, consolidation, and long-term scalability.
Read more...GigaDevice expands GD25UF Series density NuVision Electronics
DSP, Micros & Memory
GigaDevice has announced the expanded density range of its GD25UF series 1,2 V ultra-low power SPI NOR Flash, now spanning from 8 Mb to 256 Mb.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.