In addition to its broad range of fibre-optic interconnect solutions, Radiall is offering a new solution for field rapid deployment applications in harsh environments – the Pro Beam.
The interconnection is made through an optical lens in order to increase the size of the beam on the output of the connector. Each connector can be mated without using an adapter in between and there are no polarisation or gender issues, as the concept is hermaphroditic and therefore brings flexibility to field installations.
The expanded beam technology makes the Pro Beam system less susceptible to dust and pollution than other technologies. This, in addition to the robust construction with shock absorber and the fact that the connectors can handle a high number of matings due to there being no physical contact between optical parts, makes the system well suited to harsh environments.
There are two cable assembly types. For a fibre link between equipment, plug to plug cable assemblies are available, from short lengths up to 500 m or more. The long cable is placed inside a metallic reel for easy management or with the backpack option for fast field deployment. For a fibre link inside equipment, a receptacle can be placed on a wall or panel of the equipment and each simplex cable can be terminated with a standard connector such as ST, SC or LC. The other end can then be connected to an optical transceiver or receiver.
Cable assemblies are available with a choice of multimode or singlemode fibre with two or four channels.
4 mm pitch power connectors Spectrum Concepts
Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.
Read more...56 G MezzaWave connectors and cable assemblies
Interconnection
Engineered to deliver notable signal integrity, TE Connectivity’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular system
Read more...Space SMPM and SMPM-Lock connectors Hiconnex
Interconnection
Radiall has released the Space SMPM and SMPM-Lock, miniature Space connectors for high-frequency performance and high-density applications.
Read more...Compact, high density, heavy duty, thermoplastic connectors TRX Electronics
Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.
Read more...Samtec supports SGeT oHFM.c with high-performance interconnects Spectrum Concepts
Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.
Read more...Connectivity solutions for hydrogen technologies Hiconnex
Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.
Read more...Mixed-density Combo-D connectors Hiconnex
Interconnection
Positronic’s SCBM connector series is a rugged, high-performance family of mixed-density D-sub connectors engineered for demanding environments.
Read more...Same Sky expands rectangular connector portfolio Future Electronics
Interconnection
The portfolio includes male pin headers, female pin headers, and box headers, giving engineers the flexibility to select the most appropriate connector style for their specific design requirements.
Read more...Optical Ethernet connectivity for rugged environments Hiconnex
Telecoms, Datacoms, Wireless, IoT
The rugged Stratos T2 Series media converter maintains high data throughput and durability in mission-critical applications in security, tactical, and military communications.
Read more...Rugged USB-C for modern designs
Interconnection
Same Sky has expanded its USB Type-C connector portfolio to meet the growing demand for faster data transfer and higher power delivery in modern electronic designs.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version