Interconnection


Variety of one-piece interface solutions

3 September 2008 Interconnection

Samtec One Piece Interfaces are ideally suited to high shock/vibration applications with their robust design and threaded inserts to mount the connectors to the boards. They also provide low cost board stacking by reducing the number of components required to be purchased and processed, and can improve quality over elastomeric systems and pin-and-socket systems due to more reliable connections and elimination of bent pins.

Dual row interfaces on 1 mm pitch (FSI series) provide a range of board spacings from 3 mm to 10 mm between boards. For ultra low profile applications on 1 mm pitch, the SEL series provides 0,64 mm and 1,27 mm board spacing while the SEI series provides 1,65 mm board spacing.

High density array interconnects (GFZ Series) can achieve up to 1200 I/Os and a 3 mm board spacing profile. Specialty applications on 2,54 mm pitch include One Piece Power interfaces (SIB series) and single and double row One Piece Pogo style interface strips (PGP series).

For more information contact Samtec, +27 (0)11 452 8112, africa@samtec.com, www.samtec.com





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