Automated stencil printer
1 October 2008
Manufacturing / Production Technology, Hardware & Services
Essemtec has introduced SP200-AV2, a new model of its automated stencil printer SP200. The printer is an enhanced version of the previous generation system and offers increased robustness, precision and ease of use.
The new feature of the improved SP200-AV2 is Trans-Stencil-Vision which allows for fast setup and changeover procedures as well as high accuracy. Additionally, there is a theft-proof laptop mounted in the new model instead of the typical industrial PC, to help reduce the weight and to provide an additional safety feature. The new system software now runs under Windows XP and, therefore, can be integrated easily into any company-wide system.
The upper part of the machine frame, which contains vision cameras, the print head and the stencil-frame guide, has been designed for more robustness and with increased operator comfort. Until now, the squeegee had to be removed for a stencil change; with the new printer this is no longer necessary.
The vision cameras are mounted in such a way that they can look directly through the stencil apertures down to the PCB. The software of the vision system is able to differentiate between pad and substrate geometries and automatically adjusts the PCB accordingly. The Trans-Stencil-Vision feature is said to provide higher levels of speed, accuracy and reliability than other printers with a PCB shuttle mechanism, due to the direct PCB adjustment in the final position and immediate printing readiness without any further PCB movements.
The vision system features new cameras with higher resolution and integrated LED-based lighting, allowing it to operate more precisely and faster than in the SP200. The cameras are now mounted using quick fix, spring-operated clamps. Integrated rulers help to easily memorise the individual camera position; therefore, the time needed for setup or changeover is reduced significantly.
The newly designed print head comes standard with a continually operating squeegee-pressure control, similar to the SP200. This ensures constant contact pressure over the entire print movement and, for example, automatically accommodates for small steps at the PCB edges. Metal and synthetic squeegee blades can be used, and the printing movement is programmable for forward and backward actions.
The SP200-AV2 can be operated in highly flexible SMT assembly environments. The PCB handler is a true ergonomic solution due to the sideward moving loading drawer. The machine controls the entire printing cycle from adjustment to the parallel separation of stencil and PCB after the print stroke is finished.
The system offers a 23” stencil frame system with a print area of 360 x 400 mm free of any licence fees.
Further reading:
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.
Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.
Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...
printer friendly version