The new EPIA P700 Pico-ITX board from VIA Technologies couples advanced features within a streamlined, compact footprint designed for low profile systems, with extended I/O port options through two companion boards.
Now featuring native S-ATA II support, Gigabit LAN, and support for GPIO, SM bus and LPC devices, the 10 cm x 7,2 cm board is based on the VIA VX700 unified digital media IGP chipset and is powered by a 1 GHz VIA C7 or fanless 500 MHz Eden ULV processor. An integrated power adapter coupled with the 5 V S-ATA power cable negates the need for a separate power daughterboard, saving space for ultra compact systems.
Linear onboard pin-header placement means developers can use a single cable to connect various I/O devices in a streamlined way that reduces cable clutter. Flexible battery placement is also geared towards improved miniaturisation.
Two companion boards make light work of design implementation and product testing. The P700-A board features an RJ45 port, a VGA port and a COM port, while the P700-B sports four USB ports and three audio jacks for multichannel surround sound.
The P700 supports up to 1 GB of DDR2 system memory. The VX700 digital media IGP chipset boasts 2D/3D AGP graphics and video decoding acceleration for WMV and MPEG-2/4 video through the VIA UniChrome Pro II IGP graphics core. A high definition codec offers eight channel audio and DTS multichannel digital surround sound for a high fidelity experience.
Microsoft Windows IoT on ARM Altron Arrow
Computer/Embedded Technology
This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility.
Read more...Hardened-grade network switches CST Electronics
Computer/Embedded Technology
Lantronix’s hardened switches provide Layer 2 or Layer 3 networking, and are available as Power-over-Ethernet (PoE) or Power-over-Ethernet Plus (PoE+).
Read more...Ryzen V3000 computer on module Altron Arrow
Computer/Embedded Technology
SolidRun has recently announced the launch of its new Ryzen V3000 CX7 Com module, configurable with the eight-core/16-thread Ryzen Embedded V3C48 processor.
Read more...1.6T Ethernet IP solution to drive AI and hyperscale data centre chips
Computer/Embedded Technology
As artificial intelligence (AI) workloads continue to grow exponentially, and hyperscale data centres become the backbone of our digital infrastructure, the need for faster and more efficient communication technologies becomes imperative. 1.6T Ethernet will rapidly be replacing 400G and 800G Ethernet as the backbone of hyperscale data centres.
Read more...Maximising edge computing
Computer/Embedded Technology
Senao Networks has announced its launch of its SX904 SmartNIC based on the Intel NetSec Accelerator Reference Design.
Read more...UFS Ver. 4.0 embedded Flash memory devices EBV Electrolink
Computer/Embedded Technology
KIOXIA Europe has announced sampling of the industry’s first Universal Flash Storage (UFS) version 4.0 embedded Flash memory devices designed for automotive applications.
Read more...Powering factory automation into the future Rugged Interconnect Technologies
Computer/Embedded Technology
Powered by the newest 13th Gen Intel processors, ADLINK Technology’s COM-HPC-cRLS module is a future-proof edge AI solution.
Read more...Linux OS with immutable file system
Computer/Embedded Technology
What really sets VanillaOS apart from others, however, is in security, where it takes a new approach to computing by using an immutable file system for improved security and stability.
printer friendly version