Super fine pitch interconnects
18 March 2009
Interconnection
Samtec recently introduced a new narrow body, super fine pitch, low profile board-level interconnect system suitable for applications where board real estate is at a premium.
With a 4 mm wide socket strip and 5 mm wide terminal strip, the narrow body design of the super fine 0,4 mm pitch, surface mount strip system SS4/ST4 series provides excellent board space savings. In addition, the standard mated stack height is a low profile 4 mm from board to board, with a choice of application specific heights from 4,5 mm to 6 mm.
This fine pitch system is available with up to 40 positions per row in a double row design and is rated at 75 GHz in single-ended and 4,5 GHz in differential pair configurations when mated.
The blade and bean contact system is mating and alignment friendly, allowing for 1 mm of contact wipe and enhanced contact deflection. The rugged design of the system offers excellent normal force, while an optional latching system provides increased stability when mated. The connectors make an audible click when fully mated to ensure proper mating.
For more information contact Samtec, +27 (0)11 452 8112, africa@samtec.com, www.samtec.com
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