LGA scalable modules for M2M

29 April 2009 Telecoms, Datacoms, Wireless, IoT

Cinterion Wireless Modules has announced the availability of its new land grid array (LGA) M2M modules – the EES3, EGS5, EGS3 and BGS3.

The new modules are optimised for size and performance and feature solderable LGA surface mount technology for efficient, fully automated manufacturing and process consistency. The new LGA series modules are part of Cinterion’s Evolution Platform modules, which offer scalability, a broad range of specialised features, a compact footprint and compatibility with existing products for full design flexibility. All Evolution Platform LGA series modules are fully type approved.

As with all Cinterion Evolution Platform modules, the new LGA series features an advanced ARM9 processor design combined with the field-proven Cinterion M2M software stack. The latest silicon chip technology enables high performance and improved efficiency along with the benefit of long-term availability.

The EES3 is one of the smallest EDGE modules in the world, allowing the fastest transmission in GSM standards. It features an integrated TCP/IP stack over AT, serial and USB ports, and a RIL driver for Microsoft Windows Mobile 6.1 based devices.

The EGS5 features embedded JAVA processing based on a state-of-the-art ARM 9 processor architecture. Other features include GPRS Class 12 functionality, an integrated TCP/IP stack over AT, and an array of industrial interfaces such as SPI, I C bus, USB, A-D/D-A converter and multiple GPIOs.

The EGS3 offers enhanced M2M connectivity with GPRS Class 12 functionality, an integrated TCP/IP stack over AT as well as industrial interfaces SPI, I C and USB port.

The BGS3 features basic M2M functionality with GPRS Class 10 functionality, two serial interfaces, an integrated TCP/IP stack over AT and an RIL driver for Windows Mobile 6.1 based devices.

Cinterion has designed the LGA modules with a layout for heat dissipation that prevents warpage. Customisable soldering provides customers with the freedom to select the best soldering paste for each individual application, while optimised pad size and layout enables customer specific overprinting.

For more information contact Cinterion Wireless Modules, +27 (0)11 589 8011, [email protected], www.cinterion.com

Further reading:

Industrial Ethernet time sensitive networking switch
RS South Africa Telecoms, Datacoms, Wireless, IoT
The ADIN3310 and ADIN6310 are 3-port and 6-port Gigabit Ethernet time sensitive networking (TSN) switches with integrated security primarily designed for industrial Ethernet applications.

Read more...

---

When it comes to long-term reliability of RF amplifier ICs, focus first on die junction temperature
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
When considering the long-term reliability of integrated circuits, a common misconception is that high package or die thermal resistance is problematic. However, high or low thermal resistance, by itself, tells an incomplete story.

Read more...

---

Automotive-grade digital isolators
Telecoms, Datacoms, Wireless, IoT
The NSI83xx series of capacitive-based isolators from NOVOSENSE Microelectronics offer superior EOS resilience and minimal power noise susceptibility.

Read more...

---

Why bis means business for LTE Cat 1 IoT connections
NuVision Electronics Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.

Read more...

---

Wi-Fi in 2025: When is Wi-Fi 7 the answer?
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Wi-Fi 7 introduces multi-link operation and lower latency, a game-changing feature that allows devices to transmit and receive data across multiple frequency bands simultaneously to significantly reduce network congestion.

Read more...

---

Bluetooth Lite SoCs purpose built for IoT
NuVision Electronics Telecoms, Datacoms, Wireless, IoT
Whether it is enabling predictive maintenance on industrial equipment, tracking assets in dense environments, or running for years on a coin cell battery in ultra-low power sensors, developers need solutions that are lean, reliable, and ready to scale with emerging use cases.

Read more...

---

LTE Cat 1bis module
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
The A7673X LTE Cat 1bis module from SimCom is engineered to meet the growing demands of the IoT industry, offering exceptional performance and seamless integration.

Read more...

---

Track with precision
Electrocomp Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX provides innovative antennas for cellular, LTE-M, NB-IoT, LoRa, GNSS, BLE, UWB, Wi-Fi, and future Satellite IoT.

Read more...

---

Wi-Fi 7 front-end module
RF Design Telecoms, Datacoms, Wireless, IoT
The Qorvo QPF4609 is an integrated front end module designed for 802.11be systems that has integrated matching, which minimises layout area.

Read more...

---

Multi-channel downconverter
Vepac Electronics Telecoms, Datacoms, Wireless, IoT
The Downconverter from Crane Aerospace is a converter that operates from 2 to 18 GHz and delivers a noise figure of 11 dB with an attenuation range of 25 dB.

Read more...

---