|
|
|
LGA scalable modules for M2M
29 April 2009, Telecoms, Datacoms, Wireless, IoT
Cinterion Wireless Modules has announced the availability of its new land grid array (LGA) M2M modules – the EES3, EGS5, EGS3 and BGS3.
The new modules are optimised for size and performance and feature solderable LGA surface mount technology for efficient, fully automated manufacturing and process consistency. The new LGA series modules are part of Cinterion’s Evolution Platform modules, which offer scalability, a broad range of specialised features, a compact footprint and compatibility with existing products for full design flexibility. All Evolution Platform LGA series modules are fully type approved.
As with all Cinterion Evolution Platform modules, the new LGA series features an advanced ARM9 processor design combined with the field-proven Cinterion M2M software stack. The latest silicon chip technology enables high performance and improved efficiency along with the benefit of long-term availability.
The EES3 is one of the smallest EDGE modules in the world, allowing the fastest transmission in GSM standards. It features an integrated TCP/IP stack over AT, serial and USB ports, and a RIL driver for Microsoft Windows Mobile 6.1 based devices.
The EGS5 features embedded JAVA processing based on a state-of-the-art ARM 9 processor architecture. Other features include GPRS Class 12 functionality, an integrated TCP/IP stack over AT, and an array of industrial interfaces such as SPI, I C bus, USB, A-D/D-A converter and multiple GPIOs.
The EGS3 offers enhanced M2M connectivity with GPRS Class 12 functionality, an integrated TCP/IP stack over AT as well as industrial interfaces SPI, I C and USB port.
The BGS3 features basic M2M functionality with GPRS Class 10 functionality, two serial interfaces, an integrated TCP/IP stack over AT and an RIL driver for Windows Mobile 6.1 based devices.
Cinterion has designed the LGA modules with a layout for heat dissipation that prevents warpage. Customisable soldering provides customers with the freedom to select the best soldering paste for each individual application, while optimised pad size and layout enables customer specific overprinting. For more information contact Cinterion Wireless Modules, +27 (0)11 589 8011, sales.za@cinterion.com, www.cinterion.com |
|
|
|
| Share: |
 |
Via email client |
 |
 |
 |
 |
print |
|
|
|
|
|
Further reading:
- Free software for viewing S-parameters
28 August 2019, RFiber Solutions, Telecoms, Datacoms, Wireless, IoT
At this year’s International Microwave Symposium in Boston, Massachusetts,pSemi (formerly Peregrine Semiconductor), announced it is offering the industry free beta software for viewing
S-parameters. ...
- What are metamaterials and how do they relate to antennas?
28 August 2019, RF Design, Telecoms, Datacoms, Wireless, IoT
Metamaterials are an increasingly researched topic, especially where it pertains to modern antenna structures. However, there is a lot of confusion about exactly what metamaterials are and how they are ...
- The wireless technologies that will define the IoT era
25 September 2019, TRX Electronics, Telecoms, Datacoms, Wireless, IoT
As Internet of Things (IoT) applications proliferate, so do the wireless technologies that enable them. It is hard keeping track, because there are just so many possible options, with a constant stream of updates and further additions to factor in too.
- Bluetooth modules based on Nordic SoC
25 September 2019, RF Design, Telecoms, Datacoms, Wireless, IoT
Laird Connectivity has selected Nordic Semiconductor’s nRF52840 Bluetooth 5/Bluetooth Low Energy (Bluetooth LE) multiprotocol system-on-chip (SoC) to power two products in its BL654 Series: the power-amplified ...
- SoCs and software for smart home and IIoT
25 September 2019, NuVision Electronics, Telecoms, Datacoms, Wireless, IoT
Silicon Labs has introduced the next generation of its Wireless Gecko platform, Series 2, designed to make Internet of Things (IoT) products more powerful, efficient and reliable. Building on the RF and ...
- Indoor LoRaWAN gateway
25 September 2019, Altron Arrow, Telecoms, Datacoms, Wireless, IoT
The LPS8 from Dragino Technology is an open-source LoRaWAN gateway that lets the user bridge a LoRa wireless network to an IP network via Wi-Fi or Ethernet. The gateway’s LoRa wireless technology allows ...
- LoRa temperature and humidity sensor
25 September 2019, Altron Arrow, Telecoms, Datacoms, Wireless, IoT
The Dragino LHT65 temperature and humidity sensor is a Long Range (LoRa)-enabled device with an external connector to connect to external sensors such as a temperature sensor, soil moisture sensor, tilting ...
- Bluetooth/Wi-Fi combo module
25 September 2019, iCorp Technologies, Telecoms, Datacoms, Wireless, IoT
Feasycom has released the FSC-BW101, a Bluetooth/Wi-Fi combo module supporting Wi-Fi dual-frequency (2,4 GHz/5 GHz) 802.11a/b/g/n/ac and Bluetooth dual-mode (classic Bluetooth + BLE. With a working temperature ...
- Li-Fi illuminates the way to higher data rates
28 August 2019, TRX Electronics, Telecoms, Datacoms, Wireless, IoT
Radio spectrum is a precious resource and it quickly gets filled up. It did not take long for users of Wi-Fi in urban areas to understand how interference from nearby routers would affect the communications ...
- Managing the IoT on an energy budget
28 August 2019, Altron Arrow, Telecoms, Datacoms, Wireless, IoT, DSP, Micros & Memory
Historically, users wanted MCUs because they could process data and solve problems faster than a human could. MCUs also help make products more convenient and consistent in behaviour. The microcontroller ...
- Accounting for PIM with distributed antenna installations
28 August 2019, RF Design, Telecoms, Datacoms, Wireless, IoT
Passive intermodulation (PIM) distortion is the result of discontinuities, metal-to-metal contact, and material properties that lead to nonlinear characteristics of typically linear passive transmission ...
- FiRa Consortium seeks to revive UWB
28 August 2019, Telecoms, Datacoms, Wireless, IoT
A new consortium has been launched in an effort to resurrect UWB (Ultra-Wideband) technology, which gradually faded into obscurity following its initial release due mainly to its inability to compete ...
|
|
