SMD placement machine for small and mid-sized production
13 May 2009
Manufacturing / Production Technology, Hardware & Services
The Pantera–XV SMD placement machine from Essemtec directly addresses prototyping and production runs in mid-sized quantities.
The system provides high placement accuracy and speed, a broad application range, high reliability and low maintenance costs, as well as very short changeover times and excellent cost-performance ratio.
The placement machine handles the entire SMD range from 0201s to 50 x 50 mm QFPs with a fine pitch of 0,4 mm. Designed for the assembly of complex printed boards and fast changeover, the machine offers a large number of feeder slots (up to 108) in a small footprint of less than 1 square metre. All intelligent tape and stick feeders will be recognised automatically, regardless of the feeder slot being used, providing for a fast and error-free changeover process. The tape feeders are motorised and the transport speed is programmable. Also, 0201 chips can be reliably placed at a placement speed rated up to 4500 components per hour.
A further highlight of the system is increased precision, provided by the application of more accurate measuring systems. The resolution of the magnetic linear measuring system is 1 micron; the mechanism is not prone to dirt particles and dust and, therefore, provides high reliability and accuracy. For alignment, an integrated laser system measures small ICs and chip components ‘on the fly,’ and a bottom-up vision system is used for fine-pitch ICs or BGAs. Additionally, another vision system is installed for the automated correction of PCB positions as well as for the teach-in of component locations.
The Pantera–XV can be customised to match the assembly task by a multitude of options. One example is the optional dispensing system for solder paste and adhesive that reduces the cost for stencils in prototyping and also allows for higher flexibility. A further example of the optional flexibility is the exchange of the universal standard magnetic PCB holder system.
The graphic-based software concept supports easy machine operation so that usage and programming can be quickly learned. The programming interface allows for CAD data of layout software to be directly converted in an appropriate assembly program. In the case that such a data set is not available, the components can be placed manually (ie, virtually) by means of an integrated camera.
The SMD placement machine is designed for the flexible assembly of small and mid-sized production volumes. With its solid construction and high reliability, the equipment can also be used efficiently for larger production quantities.
Further reading:
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.
Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.
Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
Read more...
printer friendly version