Space-saving high-speed interconnect system
13 May 2009
Interconnection
Samtec recently expanded its high-speed, micro rugged interconnect offering with the addition of a self-mating connector system with a super-slim body design.
The high-speed, high-density 0,635 mm hermaphroditic terminal/socket strip of the LSS series features a slim row-to-row design for PCB real estate savings and is rated 9 GHz DP. The self-mating system is available with up to 50 pins per row in a double-row design and offers stack height variety and flexibility with a range of mated heights from 6 to 12 mm.
Low-cost Razor Beam contacts and the inventory-reducing, self-mating design make this strip a cost-effective solution for high speed board level applications. The rugged design offers an insertion depth of 2,36 mm and a contact wipe of 1,78 mm, and also includes a standard friction lock for increased normal force and a shroud with an audible click when properly mated. An application-specific locking clip is also available.
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